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Medicept Bond Plus Nt Total-Etch Single-Component Adhesive System
₹1,209.00₹1,555.00 (-22%)
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Medicept Bond Plus Nt Total-Etch Single-Component Adhesive System
DESCRIPTION
Bond Plus NT
- BondPlus NT is 15% filled with 0.4 micron barium glass (also found in the Medicept Flash composite).
- This unique technology provides the highest level of protection against micro leakage, while sustaining high bond strengths to a variety of surfaces.
- The filler not only reinforces the hybrid zone, but penetrates the dentin tubules as well, creating a true “structural bond” not found in unfilled or even “nano” filled adhesive systems.
- With BondPlus NT, adhesion promoters are carried in an ethanol solvent, diminishing both the tedious need for multiple coats and constant reapplication commonly found with acetone adhesives.
- BondPlus NT is indicated for both direct and indirect bonding applications
PACKING
5 ml bottle
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