Medicept Bond Plus Nt Total-Etch Single-Component Adhesive System

1,209.001,555.00 (-22%)

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Medicept Bond Plus Nt Total-Etch Single-Component Adhesive System

DESCRIPTION

Bond Plus NT

  • BondPlus NT is 15% filled with 0.4 micron barium glass (also found in the Medicept Flash composite).
  • This unique technology provides the highest level of protection against micro leakage, while sustaining high bond strengths to a variety of surfaces.
  • The filler not only reinforces the hybrid zone, but penetrates the dentin tubules as well, creating a true “structural bond” not found in unfilled or even “nano” filled adhesive systems.
  • With BondPlus NT, adhesion promoters are carried in an ethanol solvent, diminishing both the tedious need for multiple coats and constant reapplication commonly found with acetone adhesives.
  • BondPlus NT is indicated for both direct and indirect bonding applications

 

PACKING

5 ml bottle

Category: Composites Tag: Total-Etch Single-Component Adhesive System
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